ISO INTERNATIONAL STANDARD 26262-11 First edition 2018-12 Road vehicles Functional safety Part 11: Guidelines on application of IsO 26262 to semiconductors Vehicules routiers Sécurité fonctionnelle- Partie 11: Lignes directrices sur I'application de I'iS0 26262 aux semi- conducteurs Reference number IS0 26262-11:2018(E) so @IS0 2018 ut license from IHS Not for Resale, 12/20/2018 05:12:40 MST IS0 26262-11:2018(E) COPYRIGHTPROTECTEDDOCUMENT @ IS0 2018 All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior written permission. Permission can be requested from either IsO at the address below or Iso's member body in the country of the requester. ISO copyright office CP 401 : Ch. de Blandonnet 8 CH-1214 Vernier, Geneva Phone: +41 22 749 01 11 Fax: +41 22 749 09 47 Email: [email protected] Website: www.iso.org Published in Switzerland @ IS0 2018 - All rights reserved or networking permited without license from IHS Not for Resale, 12/20/2018 05:12:40 MST IS0 26262-11:2018(E) Contents Page Foreword ..V Introduction. ..vi 1 Scope. 2 Normative references 3 Terms and definitions ..1 4 A semiconductor component and its partitioning ..2 4.1 How to consider semiconductor components .2 4.1.1 Semiconductor component development .2 4.2 Dividing a semiconductor component in parts. .2 4.3 About hardware faults, errors and failure modes. .3 4.3.1 Fault models. 3 4.3.2 Failure modes. ..4 4.3.3 The distribution of base failure rate across failure modes. .4 4.4 About adapting a semiconductor component safety analysis to system level ..5 4.5 Intellectual Property (IP) .6 4.5.1 AboutIP .6 4.5.2 Category and safety requirements for IP .7 4.5.3 IPlifecycle. .9 4.5.4 Work products for IP ..11 4.5.5 Integration of black-box IP .14 4.6 Base failure rate for semiconductors .15 4.6.1 Generalnotesonbasefailurerateestimation 15 4.6.2 Permanent base failure rate calculation methods .20 4.7 Semiconductor dependent failure analysis. .41 4.7.1 Introduction to DFA .41 4.7.2 Relationship between DFA and safety analysis .42 4.7.3 Dependent failure scenarios. .42 4.7.4 Distinction between cascading failures and common cause failures ..45 4.7.5 Dependent failure initiators and mitigation measures. .45 4.7.6 DFA workflow. 51 4.7.7 Examples of dependent failures analysis 54 4.7.8 Dependent failures between software element and hardware element 55 4.8 Fault injection .55 4.8.1 General .55 4.8.2 Characteristics or variables of fault injection 55 4.8.3 Faultinjectionresults 57 4.9 Production and Operation 57 4.9.1 About Production. 57 4.9.2 Production Work Products. 58 4.9.3 About service (maintenance and repair), and decommissioning 58 4.10 Interfaceswithindistributeddevelopments 58 4.11 Confirmationmeasures 59 4.12 Clarification on hardware integration and verification .59 5 Specific semiconductor technologies and use cases .60 5.1 Digital components and memories. .60 5.1.1 About digital components. .60 5.1.2 Fault models of non-memory digital components. .60 5.1.3 Detailed fault models of memories. .61 5.1.4 Failure modes of digital components .62 5.1.5 Example of failure mode definitions for common digital blocks 62 5.1.6 Qualitative and quantitative analysis of digital component. .66 5.1.7 Notes on quantitative analysis of digital components. 67 ii e with ANSI Not for Resale, 12/20/2018 05:12:40 MST IS0 26262-11:2018(E) 5.1.8 Example of quantitative analysis 69 5.1.9 Example of techniques or measures to detect or avoid systematic failures during design of a digital component 70 5.1.10 Verification using fault injection simulation 74 5.1.11 Example of safety documentation for a digital component 75 5.1.12 Examples of safety mechanisms for digital components and memories .76 5.1.13 Overview of techniques for digital component